Plat de refroidissement par l'eau
Plaque de refroidissement par eau en aluminium usiné CNC avec soudage par friction-malaxage et surface anodisée transparente pour équipement haute puissance
Ultra High Power Equipment Fast Heat Dissipation Aluminum Water-cooled Plate Advanced aluminum water-cooled plate designed for ultra high power equipment, featuring superior heat dissipation capabilities through precision manufacturing processes and robust construction. Precision Milling Groove + Vacuum Brazing Process Utilizes high-precision CNC milling technology to create uniform, smooth flow channels on copper, aluminum, or copper-aluminum composite substrates. Dimensiona
Plaque de refroidissement par eau en aluminium, canaux de flux parallèles pour les batteries de véhicules à énergie nouvelle
Aluminum Water Cooling Plate Parallel Flow Channels For New Energy Vehicle Battery Packs This Aluminum Water Cooling Plate with Parallel Flow Channels is specifically engineered for new energy vehicle (NEV) battery pack thermal management, providing efficient and uniform heat dissipation to maintain optimal operating temperatures for lithium-ion battery cells. Crafted from high-conductivity aluminum alloy, its parallel serpentine flow channel design ensures balanced coolant
Plaque refroidie à l'eau à dissipation de chaleur rapide pour équipements à haute puissance
Fast Heat Dissipation Water Cooled Plate For Ultra-High Power Equipment 1. Precision milling groove+vacuum brazing process Using high-precision CNC milling technology, uniform and smooth flow channels are machined on copper, aluminum or copper aluminum composite substrates, with a dimensional tolerance of ± 0.01mm to ensure uniform flow of coolant and no dead corners, maximizing the heat exchange area; Subsequently, the vacuum brazing process is used to achieve seamless
Plaque de refroidissement liquide résistante aux températures élevées usinage CNC pour machines industrielles
High Temp Resistant Water Cooled Plate For Industrial Machinery 1. Precision milling groove+vacuum brazing process Using high-precision CNC milling technology, uniform and smooth flow channels are machined on copper, aluminum or copper aluminum composite substrates, with a dimensional tolerance of ± 0.01mm to ensure uniform flow of coolant and no dead corners, maximizing the heat exchange area; Subsequently, the vacuum brazing process is used to achieve seamless bonding
Plaque de refroidissement par eau en aluminium pour la gestion thermique des batteries de véhicules électriques
Aluminum Water Cooling Plate with Flow Channels for EV Battery Thermal Management This Aluminum Water Cooling Plate with Precision Flow Channels is purpose-built for electric vehicle (EV) battery thermal management, delivering reliable, uniform heat dissipation to safeguard lithium-ion battery performance and lifespan. Constructed from high-thermal-conductivity aluminum alloy, its intricately designed flow channels optimize coolant circulation, ensuring consistent temperature
Plaque de refroidissement à eau en alliage d'aluminium soudée par friction-malaxage à haute efficacité
High-Efficiency Friction Stir Welded Aluminum Alloy Water Cooling Plate Engineered for superior thermal performance in high-power industrial applications, this high-efficiency friction stir welded (FSW) aluminum alloy water cooling plate delivers exceptional heat transfer capabilities to safeguard critical electronic and mechanical components. Crafted from premium-grade aluminum alloy, the plate utilizes friction stir welding—a state-of-the-art solid-state joining technology
Plaque en aluminium refroidie par eau soudée par friction pour le stockage d'énergie
Microchannel cooling water cooling plate for new energy battery pack 1. Precision shovel tooth forming process: laying the foundation for efficient heat dissipation core Integrated CNC gear hobbing: Using a CNC gear hobbing machine, the entire aluminum/copper profile (6063 aluminum alloy, etc.) is cut into continuous and uniform heat dissipation fins in one go using a dedicated gear hobbing tool. The fins are integrated with the substrate structure, without splicing or
