6063 Aluminum Extruded Profile Radiator For PCB Heat Dissipation
Key Attributes
Place of Origin:
Dongguan, China
Minimum Order Quantity:
1PCS
Price:
10-30 USD/PCS
Supply Ability:
10000-20000 PCS
Delivery Time:
3-4 weeks
Payment Terms:
T/T
Standard Packaging:
Customized for Customers
Product Custom Attributes
Highlight
6063 Aluminum Extruded Profile
,Aluminum Extruded Profile Radiator
,PCB Heat Dissipation Aluminum Profile
Material:
Alloy 6063
Surface:
Degreased
Type:
Heat Sink
Application:
PCB Heat Dissipation
Service:
Customized
Process:
Extrusion
Product Description
Standard Extruded Aluminum 6063 Profile Radiator For PCB Heat Dissipation
Crafted from high-purity 6063 aluminum alloy, this standard extruded profile radiator is engineered to deliver exceptional heat dissipation performance for printed circuit boards (PCBs) across industrial, consumer electronics, and telecommunications applications.
Leveraging advanced aluminum extrusion technology, the radiator features a precisely designed fin structure—including optimized fin density and height—that maximizes surface area for efficient heat exchange. The inherent properties of 6063 aluminum, such as excellent thermal conductivity, corrosion resistance, and lightweight durability, ensure rapid heat transfer from PCB components (e.g., power transistors, LEDs, integrated circuits) to the ambient air, preventing overheating and extending device lifespan.
Whether for high-power industrial PCBs, consumer electronics, or telecom equipment, this 6063 aluminum extruded radiator balances cost-effectiveness, reliability, and performance—making it the ideal thermal management solution for PCB heat dissipation needs.
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