Aluminum Alloy Water Cooling Plate High Efficiency Friction Stir Welded
Key Attributes
Place of Origin:
Dongguan, China
Minimum Order Quantity:
1PCS
Price:
50-150 USD/PCS
Supply Ability:
2000-3000 PCS per month
Delivery Time:
3-5 weeks
Payment Terms:
T/T
Standard Packaging:
Customized for Customers
Product Custom Attributes
Highlight
Aluminum Alloy Water Cooling Plate
,Friction Stir Welded Cold Plate
,FSW Water Cooled Cold Plate
Material:
Aluminum Alloy
Outletdiameter:
Customizable, Commonly 1/4 Inch Or 1/2 Inch
Sample Lead Time:
15-25 Days
Surface Treatment:
Passivation
Process:
Friction Stir Welded
Keyword:
Water Cooling Plate
Product Description
High-Efficiency Friction Stir Welded Aluminum Alloy Water Cooling Plate
Engineered for superior thermal performance in high-power industrial applications, this high-efficiency friction stir welded (FSW) aluminum alloy water cooling plate delivers exceptional heat transfer capabilities to safeguard critical electronic and mechanical components.
Crafted from premium-grade aluminum alloy, the plate utilizes friction stir welding—a state-of-the-art solid-state joining technology—to create seamless, defect-free bonds between the base plate and internal flow channels. Unlike traditional fusion welding methods, FSW eliminates thermal distortion, porosity, and weld cracks, ensuring maximum structural integrity, leak-proof sealing, and uniform thermal conductivity across the entire plate surface. This advanced welding process also preserves the aluminum alloy’s inherent thermal efficiency, enabling rapid heat dissipation even under extreme continuous-load conditions.
Designed with optimized internal serpentine or parallel flow paths, the cooling plate maximizes coolant contact area, accelerating heat exchange between the heated components and circulating fluid. Its lightweight yet robust aluminum construction reduces overall system weight while offering excellent corrosion resistance, making it ideal for use in electric vehicle (EV) battery packs, industrial inverters, laser equipment, power electronics, and high-performance computing (HPC) systems.
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