Medical Device Assembly PEEK Turned Machined Parts with Precision Bore
Key Attributes
Place of Origin:
Dongguan, China
Minimum Order Quantity:
1PCS
Price:
1USD-10USD
Supply Ability:
50000-100000 PCS per month
Delivery Time:
2-3 weeks
Payment Terms:
T/T
Standard Packaging:
Packed in cartons
Product Custom Attributes
Highlight
PEEK Turned Machined Parts
,Medical Device Assembly Turned Machined Parts
,Turning Machining Parts with Precision Bore
Applications:
Automotive, Aerospace, Electronics, Machinery
Dimensions:
Customizable According To Drawing/specifications
Batch Size:
Single Piece To Mass Production
Threading:
Available (internal/external Threads)
Manufacturing Process:
Turning (lathe Machining)
Material:
PEEK
Color:
White
Product Description
Turned PEEK Machined Component with Precision Bore for Medical Device Assembly
This precision-turned PEEK flange is engineered to meet the stringent demands of semiconductor wafer handling equipment, delivering exceptional performance, purity, and dimensional stability in ultra-clean manufacturing environments. Crafted from medical-grade, ultra-pure PEEK via precision CNC turning, it features tight tolerances and a smooth, non-particulate surface that minimizes contamination risks—critical for maintaining the integrity of delicate semiconductor wafers during processing and transport.
Designed for secure, reliable integration into wafer handling systems, the flange incorporates precision-machined mounting holes and a precision-bored central bore, ensuring accurate alignment and stable attachment of wafer carriers, robotic end-effectors, and other critical components. PEEK’s inherent properties—including high thermal stability, chemical resistance to harsh semiconductor processing chemicals, and low outgassing—make it an ideal material for this application, eliminating the risk of material degradation or contamination that can compromise wafer yield and quality.
Fully customizable to meet the unique specifications of semiconductor manufacturing lines, this PEEK flange can be tailored in dimensions, bore sizes, and mounting configurations to support a wide range of wafer handling processes, from lithography and etching to wafer sorting and packaging. Its lightweight, robust construction ensures consistent performance even in high-speed, automated production environments, providing a contamination-free, precision-engineered solution that upholds the highest standards of semiconductor manufacturing.
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