Power Electronics U Frame Aluminum Heatsink Extruded with Internal Straight Fins
Key Attributes
Place of Origin:
Dongguan, China
Minimum Order Quantity:
1PCS
Price:
3-10 USD/PCS
Supply Ability:
50000-100000 PCS per month
Delivery Time:
3-4 weeks
Payment Terms:
T/T
Standard Packaging:
Customized for Customers
Product Custom Attributes
Highlight
U Frame Aluminum Heatsink
,Power Electronics Extruded Aluminum Heatsink
,Internal Straight Fins Aluminum Heatsink
Material:
Aluminum Alloy
Surface Finish:
Degreased
Manufacturing Process:
Extrusion
Type:
Heat Sink
Fin Thickness:
1.0mm To 3.0mm
Application:
Electronics Cooling, LED Cooling, Power Devices
Product Description
Extruded Aluminum U-Frame Heat Sink with Internal Straight Fins for Power Electronics
This Extruded Aluminum U-Frame Heat Sink with Internal Straight Fins is precision engineered for high-performance thermal management of power electronics components, delivering reliable passive heat dissipation for high-power modules, inverters, converters, and industrial power control units.
Crafted from high-thermal-conductivity aluminum alloy via one-piece precision extrusion, the integral U-frame structure ensures exceptional structural rigidity and seamless thermal conduction, while the dense internal straight fin array maximizes heat dissipation surface area—enabling efficient heat transfer from heat-generating power electronic components to the surrounding airflow. The extrusion manufacturing process guarantees uniform fin dimensions and consistent thermal performance across all units, eliminating thermal resistance gaps associated with assembled or bonded heat sink designs.
Optimized for the thermal demands of power electronics, this U-frame heat sink features a open-channel design that facilitates unobstructed airflow and easy integration with heat spreaders, mounting brackets, or cooling fans. Its robust aluminum construction offers excellent corrosion resistance and durability for long-term operation in industrial, automotive, and renewable energy applications, where stable thermal regulation is critical to preventing component overheating and ensuring extended service life.
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