Pin Fin Extruded Aluminum Heat Sink For Electronic Component Thermal
Key Attributes
Place of Origin:
Dongguan, China
Minimum Order Quantity:
1PCS
Price:
1-10 USD/PCS
Supply Ability:
50000-100000 PCS per month
Delivery Time:
2-4 weeks
Payment Terms:
T/T
Standard Packaging:
Customized for Customers
Product Custom Attributes
Highlight
Extruded Pin Fin Heat Sink
,ICs Extruded Aluminum Heat Sink
,Electronic Component Thermal Pin Fin Heatsinks
Material:
Aluminum Alloy
Surface Treatment:
Degreased
Length:
As Required
Color:
Clear
Service:
Custom Aluminum Heat Sink
Compatible Devices:
CPU, GPU, Power IC
Product Description
Extruded Aluminum Heat Sink With Pin-Fin Structure For Electronic Component Thermal
This Extruded Aluminum Heat Sink with Pin-Fin Structure is expertly designed for electronic component thermal management, delivering efficient passive heat dissipation to maintain optimal operating temperatures for sensitive electronics.
Crafted from high-purity aluminum via precision extrusion, its uniform pin-fin array maximizes surface area for enhanced thermal convection, effectively drawing heat away from critical components such as integrated circuits (ICs), power modules, and LED drivers. The one-piece extrusion construction ensures excellent thermal conductivity, structural rigidity, and corrosion resistance, eliminating the risk of thermal resistance from bonded or assembled fins.
With a compact, lightweight profile and mounting tab for easy installation, this heat sink is ideal for use in consumer electronics, industrial control systems, and LED lighting applications. It provides reliable thermal stability, prevents overheating, and extends the service life of electronic components, making it an essential solution for high-performance thermal management.
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